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Join OMRON this September in Taipei to explore how our advanced inspection technologies and AI-driven solutions are transforming semiconductor manufacturing. 

Our proprietary X-ray and visualization systems detect even the tiniest defects in chips and packaging—ensuring higher quality and faster production, from R&D to mass manufacturing.

Event Theme

Visualized Quality Fuels a Future with AI:

Shaping the Future of Manufacturing through Visualization and AI

Secure your spot to meet OMRON experts and experience our latest innovations in semiconductor inspection.

• Date: Thu, Sep 11 (16:05–16:25)
• Venue: TaiNEX 2, 7F
• Topic: 3D X-ray in the Chiplet Era: Visualizing Hidden Defects and Addressing Inevitable Challenges with Automated Inspection Technology

September 10–12, 2025 | Taipei Nangang Exhibition Center | Booth Q5630

Key Topics

1. Accelerating Technology Validation through Industry–Academia Collaboration with   National Cheng Kung University

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2. Digital Twin Development Platform powered by NVIDIA Omniverse integration

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3. Innovation & Co-Creation from the new “Semiconductor & Incubation Center”

Exhibition Highlights

•VT-X Series for Advanced Packaging

https://www.fa.omron.co.jp/product/inspection-system/sji-inspection-system/axi_en/#Sec_x950

High-speed CT-X solder joint inspection with defect samples (HIP, TGV) and visual insights into industry challenges.

•Next-Generation AI & Precision Control Solutions

Boosting yield rates for advanced packaging implementation (reference exhibit).

Special Sessions

HIGS – Heterogeneous Integration Global Summit

Expertise

Linking Semiconductors × Precision Manufacturing, covering CNC machinery, ultra-precision components, and process control

Focus of Talk

Demonstrating next-generation packaging and inspection technologies through precision manufacturing

Event Details

    • Event: SEMICON Taiwan 2025

    • Date: September 10–12, 2025

    • Location: Taipei Nangang Exhibition Center, Halls 1 & 2

    • OMRON Booth: Hall 2, Q5630

    • Nearest Metro: Nangang Exhibition Center Station (few minutes' walk)

For media inquiries:

    • Global PR: mei@globalpr.agency

    • OMRON (EN/CN/JP): naiyuan.yeh@omron.com

Special Guest

Background

• From Fukushima Prefecture, Japan
• Graduate of Tohoku University, Faculty of Engineering
• Professor at the Institute of Innovative Semiconductor andSustainable Manufacturing, National Cheng Kung University (Taiwan)

Experienced in both industry and academia in Japan and Taiwan

Expertise

• Nano/micro-structure processing
• Heterogeneous material bonding for:
• Advanced packaging
• Optoelectronics
• Biomedical materials
• High-frequency components

Research Contributions

• Microfluidic light-emitting devices
• High-reliability low-temperature bonding
• Organic solar cells
• Materials for regenerative medicine
• Next-generation communication filters

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Collaboration & Vision

• Works with international partners, including Omron, on advanced packaging and 3D inspection
• Philosophy: technology should create value for society
• Looks forward to active exchange of ideas between academia and industry.

Professor Jun Mizuno

Shinji Sugita

General Manager

Inspection Systems Business Headquarters

Experience

18 years at OMRON, driving advancements in AOI and AXI systems and leading business growth through engineering innovation

Expertise

Quality control technologies, solder inspection solutions for SMT and semiconductor back-end processes

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Focus of Talk

Groundbreaking integration technologies for advanced packaging, including 3DIC and CoWoS, in the era of AI and 5G Recognition

Widely acknowledged as a leading voice in thought leadership and innovation within the industry

Yuki Tsuchihashi

Section Manager

X-ray Inspection Systems Development Secion

Special Guest – Professor Jun Mizuno

Available for booth interviews only