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Enhancing AI Manufacturing Through Quality Visualization

Three Key Exhibition Highlights

3D CT visualizes internal structures and quantifies quality conditions, while OMRON transforms inspection data into actionable Quality Data to help manufacturing sites identify quality risks, analyze root causes, and improve processes.

Book a Visit to the OMRON Booth

CT-Based 3D X-ray Automated Inspection Solution for Advanced Packaging

Media Contact:

OMRON（EN/JP/CH）：naiyuan.yeh@omron.com

GlobalPR：mei@globalpr.agency

Event

Dates

Venue

Booth

SEMICON Taiwan 2026

Wed, Sept. 2 – Fri, Sept. 4, 2026

Taipei Nangang Exhibition Center, TaiNEX 1 and 2

TaiNEX 2 / 1F / Q5842

Designed for advanced packaging inspection, including TGVs, microbumps, voids, and chiplets, the solution combines AXI with CT-based 3D X-ray technology.

From R&D to mass production, it helps users visualize internal structures, perform quantitative inspection, identify quality risks, and improve processes.

Digital Twin × Quality Data Applications

Through its collaboration with NVIDIA Omniverse, OMRON will demonstrate how Quality Data can be used to build Digital Twins.

By integrating visual and X-ray inspection results, the system reproduces substrate warpage and bonding conditions in 3D, connecting inspection, analysis, and engineering improvement.

Material Handling, Visual Inspection, and IAB Control Technologies

OMRON will also demonstrate technologies for semiconductor manufacturing, including wafer handling, visual inspection, component products and related solutions, safety and sensor technologies, and automation control solutions.

Technical Presentations During the Event

Strategic Materials Conference

01

Official Program (No Pre-registration Required)

Topic:

Advanced Packaging Inspection Technology Including TGV

~ A New Approach to Achieve Consistent Pass/Fail Judgement from Development to Mass Production ~

Time & Location

Date: Thursday, September 3, 2026

Location: TaiNEX Hall 2 (Taipei Nangang Exhibition Center, Hall 2)

Speaker

Mr. Yujin Fujita

General Manager, AXI Planning Division, Inspection Systems Business Headquarters

Profile

General Manager of the AXI Planning Division at OMRON, leading business strategy and product planning for inspection solutions in the SMT industry.

Joined OMRON in 1997 and has over 25 years of experience in engineering, global sales, and product management. Currently driving the expansion of inspection solutions into advanced semiconductor packaging.

TechXPOT Mini Seminar

02

On-Site Seminar: Please RSVP

Topic:

If You Can Visualize It, You Can Understand It. If You Can Quantify It, You Can Improve It.

~ The New Role of In-line 3D CT X-Ray Inspection in Semiconductor Backend Processes ~

Time & Location

Time: Thursday, September 3, 2026, 13:20–13:40

Location: TaiNEX Hall 2, OMRON Booth Q6252

Speaker

Mr. Yuki Tsujihashi

Manager, X-Ray Inspection System Development Department, Inspection Systems Business Headquarters

Profile

Yuki, Product Development Manager at OMRONs Inspection Systems Business Division, specializes in the intersection of semiconductor and precision manufacturing. His expertise in CNC machinery, ultra-precision components, and process control contributes to the development of advanced packaging and inspection technologies.

Reserve your visit to gain insights into advanced packaging quality.

Visit the OMRON booth to explore 3D X-ray, Digital Twin technology, and Quality Data solutions for semiconductor manufacturing and advanced packaging.

The OMRON team can arrange an on-site technical discussion based on your products, processes, and inspection requirements.